From June 12 to 14, 2026, Litian Century successfully made its appearance at the 3rd Changchun International Optical Expo · Light Conference & the Optical Society of China (OSC) Changchun Academic Conference (hereinafter referred to as the “Optical Expo”). The exhibition took place at the Changchun Northeast Asia International Expo Center. Litian Century presented its comprehensive range of ultra-precision diamond tool solutions, attracting numerous research institutions, manufacturers, and professional visitors from the upstream and downstream of the optoelectronics industry chain both domestically and internationally.

As a high-tech enterprise specializing in ultra-precision diamond tools, Litian Century showcased five series of high-performance ultra-precision diamond cutting tools: the ultra-precision diamond milling tool series, ultra-precision diamond turning tool for infrared lenses, Optical mold core diamond tools, laser-assisted diamond turning tools, and diamond wafer scribing tool.

Among them, the ultra-precision diamond milling tool series is designed for high-precision machining of molds and micro-structured freeform surfaces, ensuring that both the axial and radial accuracy at the cutting point is controlled within 0.001 mm. Leveraging advanced tool design and sharpening processes, this series effectively meets the machining requirements of complex surfaces such as micro-structured arrays and precision molds. It attracted research institutions and manufacturers including the Changchun Institute of Optics, Fine Mechanics and Physics, Chinese Academy of Sciences (CIOMP), and New Industry Optoelectronics for in-depth discussions on technical adaptation and collaboration.

The ultra-precision diamond turning tool for infrared lenses are specifically designed for ultra-precision machining of various infrared materials such as silicon, germanium, and chalcogenide glasses, achieving an aspheric form accuracy of PV < 0.2 μm and surface roughness Ra < 0.01 μm. These products demonstrated exceptional performance in the manufacturing of high-precision infrared optical systems and became a key focus at the booth.

The optical mold core diamond tools are suitable for ultra-precision machining of various Fresnel lenses and camera molds, with tool waviness controllable within 20 nm and the machined product achieving surface roughness within 5 nm. With nano-scale machining capability, this series provides critical technical support for the manufacturing of core mold inserts for precision optical imaging, automotive lenses, mobile phone cameras, and more.

The laser-assisted diamond turning tools employ laser-assisted technology to locally soften the material being machined, enabling direct processing of hard and brittle materials (such as monocrystalline silicon, calcium fluoride, and zinc sulfide) that are difficult to machine with conventional methods, without the need for complex auxiliary equipment. This opens up a new path for precision machining of optical components made from ultra-hard and brittle materials.

The diamond wafer scribing tool can be customized in terms of specifications and shapes. The tool shank can be customized as T-shaped or quad-ridged, with specifications available as 4P or 8P. These diamond scribing tools are not affected by moisture or heat, enabling dry, clean scribing technology for processing various wafers.

During the exhibition, our booth was highly active, receiving over 200 professional visitors, including representatives from more than 10 international companies and research institutions from Germany, South Korea, Russia, and other countries. The technical team of our company engaged in in-depth discussions with visitors on product performance, typical application cases, and future trends in ultra-precision machining. The on-site exchanges were vibrant, and cooperation intentions were significant.

This Optical Expo covered a total area of 86,000 square meters, bringing together 890 exhibitors from home and abroad, including 42 foreign enterprises, a year-on-year increase of 55%. Concurrent events such as the 2026 Atomic-level Manufacturing Innovation and Development Conference and the Light Conference further highlighted the strategic value of ultra-precision machining technology in the optoelectronics industry. The global ultra-precision diamond cutting tool market was approximately USD 223 million in 2025 and is projected to reach USD 341 million by 2032, with a compound annual growth rate (CAGR) of approximately 6.28%.

This exhibition not only significantly enhanced the brand awareness of Litian Century in the field of ultra-precision diamond tools but also served as a vital opportunity to directly engage with the upstream and downstream of the optoelectronics industry chain and accurately capture cutting-edge machining demands. From infrared optical lenses to high-precision camera mold inserts, from precision electronics to aerospace, Litian Century is consistently committed to helping China’s optoelectronics industry achieve higher quality through “micron-level precision.” In the future, the company will continue to deepen its focus on ultra-precision tool technology, serving as the “invisible backbone” of China’s high-quality optoelectronics industry development.